Advanced Micro Devices CEO Lisa Su unveiled the company’s upcoming data center platform during her keynote at CES 2026 in Las Vegas on Monday, offering the first detailed look at the Helios system and new insight into how it will be built. Su brought a full Helios rack unit on stage and described it as the “world’s best AI rack,” a remark widely interpreted as a direct challenge to rival Nvidia.
Nvidia (NVDA) currently sets the benchmark for rack-scale AI systems and debuted its latest platform, the Vera Rubin NVL72, at CES on Monday. AMD’s Helios is positioned to compete directly with Nvidia’s NVL systems, matching the NVL72’s configuration of 72 Rubin GPUs with 72 of AMD’s MI455X chips.
READ: AMD CEO dismisses AI spending concerns, projects $1 trillion data center market by 2030 (
Alongside Helios, AMD also shared additional details about its upcoming MI500 series data center GPUs, announcing that the new lineup is expected to deliver up to a 1,000x increase in AI performance compared to the company’s current MI300X GPUs.
During her keynote, Su also outlined AMD’s broader vision for the future of artificial intelligence. She said the company believes that around five billion people will be using AI every day within the next five years. To meet that demand, she added, technology companies will need to expand global computing capacity by 100 times in the coming years—a level of growth that would benefit both AMD and Nvidia.
AMD also highlighted its growing presence in the robotics sector. Su invited Generative Bionics CEO Daniele Pucci on stage to unveil the company’s humanoid robot for the first time. Powered by AMD CPUs and GPUs, the robot, named GENE.01, is designed to operate in industrial environments. AMD is an investor in Generative Bionics.
READ: AMD, Department of Energy enter into $1 billion partnership for AI supercomputers (
Shifting focus to the PC market, Su discussed AMD’s expanding lineup of AI PCs. She announced that the company’s latest Ryzen AI 400 Series and Ryzen AI Pro 400 Series chips will go head-to-head with Intel’s new Core Ultra 3 processors, which are built on Intel’s 18A process technology. According to AMD, the new chips are expected to deliver multi-day battery life alongside strong AI and gaming performance.
AMD also showcased its Ryzen AI Max+ chips, targeting premium thin-and-light laptops, workstations, and mini-PCs, as well as its new Ryzen AI Halo developer platform. Essentially a compact desktop PC, the Halo system is designed to allow developers to build and test AI models locally, rather than relying on cloud-based infrastructure.
Two months ago, Su reiterated her view that spending on artificial intelligence is unlikely to slow anytime soon. At the time, she raised AMD’s estimate of the total addressable market for AI data centers to $1 trillion by 2030, up from a previous projection of $500 billion, underscoring the scale of opportunity the company sees ahead.