Apple said it will expand its partnership with chipmaker Broadcom in a multi-year deal expected to exceed $30 billion. This deal will lead to the production of more than 15 billion U.S.-made chips and includes a $1.5 billion expansion of Broadcom’s facility in Fort Collins, Colorado, according to Apple, which did not provide a timeline for the new capacity to come online.
“The cutting-edge components built in Fort Collins are essential to delivering the incredible performance and connectivity our customers expect, and we’re proud to deepen our investments in U.S.-based suppliers that share our commitment to excellence and innovation,” Apple CEO Tim Cook said in a statement. “We’re grateful to the president and his administration for supporting important projects like this.”
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For Cook, the agreement is part of a push to invest in American manufacturing, something that has been heavily emphasized by the Trump administration. The deal is the biggest part of Apple’s $600 billion, four-year U.S. investment plan announced in 2025.
“Apple has been working with the Administration and businesses across the U.S. to help create an end-to-end silicon supply chain in America, and today’s announcement advances those efforts,” Apple said in a release. Broadcom CEO Hock Tan said Apple’s commitment will help the chipmaker expand its manufacturing footprint in Fort Collins.
According to a CNBC report, Broadcom has long supplied Apple with connectivity components, and the new deal deepens the relationship between the two companies.
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Broadcom disclosed in a filing with the Securities and Exchange Commission (SEC) on Monday that it had entered into new long-term agreements with Apple to develop and supply “custom ASIC silicon products” for multiple generations of Apple products through 2031. ASICs are application-specific integrated circuits and are increasingly being used for artificial intelligence workloads.
Earlier this year, Broadcom projected that its artificial intelligence chip revenue would exceed $100 billion by 2027, indicating surging demand for custom chips in a market dominated by Nvidia.
In April, Apple announced Tim Cook will transition to the role of the executive chairman of the company’s board of directors. John Ternus, the company’s senior vice president of Hardware Engineering, will become Apple’s next chief executive officer effective on Sept. 1. Cook will continue in his role as CEO through the summer as he works closely with Ternus on a smooth transition.